- برند: NoEnName_Null
- Support کانال حافظهs: 2
- PCIe VERSION: PCIe 3.0
- Application: Desktop
- Number OF Therads: 8
- Usage Scenario: Workstation
- Support نوع حافظه: DDR3
- Support Chipset Models: AMD 970
- Processor Type: FX-Series
- نوع چیپ: 32 nanometers
- Default TDP / TDP: 125W
- Origin: CN(Origin)
- Unlocked: YES
- نوع سوکت: Socket AM3
- Type: Octa Core
- GPU-built: YES
- تاریخ لانچ: 2010
- تعداد هسته سی پی یو: Eight Core
- Package: No
- مدل: AMD FX-Series FX-8120
Note:
1 : The CPU is used, not brand new. It is normal that used CPU has scratch. If you mind scratches. Please buy a new CPU. Don’t buy used!!!
2 : The origin of CPU is China, Malaysia, Vietnam, Costa Rica etc. The performance is the same. Random delivery. If you mind, please don’t buy it.
3 : This link contains only one used CPU, no cooler.
Photo (appearance, color, origin, serial number) for reference only, random delivery, if customers have specific requirements of the product’s quality, can give us message,thanks.
4:All CPUs sold by our store have exclusive seals. After sale, we need to rely on the seals. Otherwise, we will not deal with them.
5:Please make sure motherboard upgraded latest Bios.And support this CPU.
The product parameters shall be subject to the official website.System parameter error。
Type:CPU |
Manufacturer:AMD |
family:Bulldozer |
microprocessors:FX-Series |
Type |
CPU / Microprocessor |
Market segment |
Desktop |
Family |
AMD FX-Series
|
مدل |
FX-8120 |
CPU part numbers |
|
Frequency |
3100 MHz |
Turbo frequency |
3400 MHz (more than 4 cores) |
Bus speed |
One 2600 MHz 16-bit HyperTransport link |
Package |
940-pin organic micro Pin Grid Array (UOC940) |
Socket |
Socket AM3+ |
Size |
1.57" x 1.57" / 4cm x 4cm |
Weight |
1.4oz / 38.3g (CPU) |
Introduction date |
October 12, 2011 |
Price at introduction |
$205 |
Architecture / Microarchitecture |
|
Microarchitecture |
Bulldozer |
Platform |
Scorpius |
Processor core |
Zambezi |
Core stepping |
OR-B2 |
CPUID |
600F12 |
Manufacturing process |
0.032 micron Hi-K Metal Gate process with silicon-on-insulator (SOI) technology |
Die size |
316mm2 |
Data width |
64 bit |
The number of CPU cores |
8 |
The number of threads |
8 |
Floating Point Unit |
Integrated (shared between each pair of cores) |
Level 1 cache size |
4 x 64 KB 2-way set associative shared instruction caches |
Level 2 cache size |
4 x 2 MB 16-way set associative shared exclusive caches |
Level 3 cache size |
8 MB 64-way set associative shared cache |
Cache latency |
3 (L1 cache) |
Multiprocessing |
Uniprocessor |
Features |
|
Low power features |
|
Integrated peripherals / components |
|
Integrated graphics |
None |
Memory controller |
The number of controllers: 1 |
Other peripherals |
HyperTransport 3.1 technology |
Electrical / Thermal parameters |
|
V core |
0.975V – 1.4125V |
Maximum operating temperature |
61°C |
Thermal Design Power |
125 Watt |
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